anykey/stencil/gerber/stencil.gbrjob

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{
"Header": {
"GenerationSoftware": {
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "(6.0.2)"
},
"CreationDate": "2022-03-05T21:26:04+01:00"
},
"GeneralSpecs": {
"ProjectId": {
"Name": "stencil",
"GUID": "7374656e-6369-46c2-9e6b-696361645f70",
"Revision": "rev?"
},
"Size": {
"X": 27.102,
"Y": 53.102
},
"LayerNumber": 2,
"BoardThickness": 1.6,
"Finish": "None"
},
"DesignRules": [
{
"Layers": "Outer",
"PadToPad": 0.0,
"PadToTrack": 0.0,
"TrackToTrack": 0.127,
"MinLineWidth": 0.2,
"TrackToRegion": 0.2,
"RegionToRegion": 0.2
}
],
"FilesAttributes": [
{
"Path": "stencil-PasteBottom.gbp",
"FileFunction": "SolderPaste,Bot",
"FilePolarity": "Positive"
},
{
"Path": "stencil-PasteTop.gtp",
"FileFunction": "SolderPaste,Top",
"FilePolarity": "Positive"
}
],
"MaterialStackup": [
{
"Type": "Legend",
"Name": "Top Silk Screen"
},
{
"Type": "SolderPaste",
"Name": "Top Solder Paste"
},
{
"Type": "SolderMask",
"Name": "Top Solder Mask"
},
{
"Type": "Copper",
"Name": "F.Cu"
},
{
"Type": "Dielectric",
"Material": "FR4",
"Name": "F.Cu/B.Cu",
"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
},
{
"Type": "Copper",
"Name": "B.Cu"
},
{
"Type": "SolderMask",
"Name": "Bottom Solder Mask"
},
{
"Type": "SolderPaste",
"Name": "Bottom Solder Paste"
},
{
"Type": "Legend",
"Name": "Bottom Silk Screen"
}
]
}